Retraction
Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures
Paper Information
Record ID:
19520
Author(s):
Journal:
Publication Date:
April 06, 2017
Retraction Date:
October 01, 2017
(8.1 years years ago)
Subject:
Broad Categories:
Engineering
Engineering
Specific Fields:
Engineering - Electrical
Engineering - Electrical
Institutions:
Countries:
Article Type:
Publisher:
IEEE: Institute of Electrical and Electronics Engineers
Open Access:
Yes
PubMed ID:
Not indexed in PubMed
Retraction PubMed ID:
Not indexed in PubMed
Retraction Details
Retraction Reason:
Nature of Retraction:
Retraction
Retraction Notice:
10.1109/TEMC.2017.2685348Additional Notes:
see also: https://www.ieee.org/about/news/2018/retractions-from-ieee-transactions-on-electromagnetic-compatibility.html;
Citations (6)
6
Total Citations6
Post-Retraction(100.0%)
0
Pre-Retraction0
Same DayPost-Retraction Citation Analysis
0
Within 30 days
3
Within 1 year
1
After 2+ years
1774
Days since retraction (latest)
Paper citing Localization of Short and Open Defects in Multilay...
Unknown Authors
Unknown Journal
Published: Aug 2022
1774 days after retraction
Paper citing Localization of Short and Open Defects in Multilay...
Unknown Authors
Unknown Journal
Published: Dec 2018
426 days after retraction
Paper citing Localization of Short and Open Defects in Multilay...
Unknown Authors
Unknown Journal
Published: Dec 2018
426 days after retraction
Paper citing Localization of Short and Open Defects in Multilay...
Unknown Authors
Unknown Journal
Published: Oct 2018
365 days after retraction
Paper citing Localization of Short and Open Defects in Multilay...
Unknown Authors
Unknown Journal
Published: Jul 2018
273 days after retraction
Paper citing Localization of Short and Open Defects in Multilay...
Unknown Authors
Unknown Journal
Published: Apr 2018
205 days after retraction
Quick Stats
Total Citations:
6
Years Since Retraction:
8.1 years
Open Access:
Yes
Last Checked:
Never