Retraction
High-bandwidth IC interconnects with silicon interposers and bridges for 3D multi-chip integration and packaging
Paper Information
Record ID:
45169
Author(s):
Journal:
Publication Date:
March 12, 2017
Retraction Date:
May 08, 2017
(8.5 years years ago)
Subjects:
Institution:
Intel Research, Hillsboro, OR, USACountry:
🇺🇸 United StatesArticle Type:
Publisher:
IEEE: Institute of Electrical and Electronics Engineers
Open Access:
Yes
PubMed ID:
Not indexed in PubMed
Retraction PubMed ID:
Not indexed in PubMed
Retraction Details
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Quick Stats
Total Citations:
0
Years Since Retraction:
8.5 years
Open Access:
Yes
Last Checked:
Never