Retraction

Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints

Paper Information

Record ID:
45439
Author(s):
Bingfeng Guo
Ru Huang
Jinye Yao
Xiao Qi
Anil Kunwar
Yunpeng Wang
Haitao Ma
Journal:
2018 19th International Conference on Electronic Packaging Technology (ICEPT) ( IEEE: Institute of Electrical and Electronics Engineers )
Publication Date:
August 08, 2018
Retraction Date:
October 04, 2018 (7.1 years years ago)
Subjects:
Broad Categories:
Engineering Materials Science
Institutions:
Country:
🇨🇳 China
Article Type:
Conference Abstract/Paper
Publisher:
IEEE: Institute of Electrical and Electronics Engineers
Open Access:
Yes
DOI:
10.1109/ICEPT.2018.8480771
PubMed ID:
Not indexed in PubMed
Retraction PubMed ID:
Not indexed in PubMed

Retraction Details

Retraction Reasons:
Nature of Retraction:

Retraction

Retraction Notice:
10.1109/ICEPT.2018.8480771

Citations (0)

0
Total Citations
0
Post-Retraction
0
Pre-Retraction
0
Same Day
No citations found for this paper.
Quick Stats
Total Citations: 0
Years Since Retraction: 7.1 years
Open Access: Yes
Last Checked: Never
Related Papers
Synthesis and Workability Behavior of Cu-X wt.% TiC (x = 0,…
Bioinorganic Chemistry and Applications • 9 citations
In-situ study the effect of IMC thickness on tensile behavi…
2019 20th International Conference on Electronic Packaging Technology (ICEPT) • 0 citations
Investigation on the improvement of physico-mechnical, visc…
International Journal of Plastics Technology • 3 citations
Aligned Nano-Porous Microwave Exfoliated Graphite Oxide Ion…
Advanced Materials • 10 citations
Synthesis, characterization and assessment thermal properti…
Frontiers of Chemical Science and Engineering • 2 citations
Actions
More from this journal Similar subjects View Original Paper View Retraction Notice