Retraction
In-situ study the effect of IMC thickness on tensile behavior of the Cu/Sn0.7Cu/Ni interconnects
Paper Information
Record ID:
45440
Author(s):
Journal:
Publication Date:
August 12, 2019
Retraction Date:
April 30, 2020
(5.6 years years ago)
Subjects:
Institutions:
Country:
🇨🇳 ChinaArticle Type:
Publisher:
IEEE: Institute of Electrical and Electronics Engineers
Open Access:
Yes
PubMed ID:
Not indexed in PubMed
Retraction PubMed ID:
Not indexed in PubMed
Retraction Details
Retraction Reasons:
Nature of Retraction:
Retraction
Retraction Notice:
10.1109/ICEPT47577.2019.246033Citations (0)
0
Total Citations0
Post-Retraction0
Pre-Retraction0
Same Day
No citations found for this paper.
Quick Stats
Total Citations:
0
Years Since Retraction:
5.6 years
Open Access:
Yes
Last Checked:
Jul 24, 2025