Retraction
Features of contact melting of semiconductors and their microstructures under thermal shock conditions
Paper Information
Record ID:
53321
Journal:
Publication Date:
March 01, 2022
Retraction Date:
October 30, 2023
(2.1 years years ago)
Subjects:
Institution:
Moscow Polytechnic University, 38 Bolshaya Semyonovskaya Str, Moscow, Russian Federation, 107023Country:
🇷🇺 RussiaArticle Type:
Publisher:
Springer
Open Access:
Yes
PubMed ID:
Not indexed in PubMed
Retraction PubMed ID:
Not indexed in PubMed
Retraction Details
Citations (2)
2
Total Citations0
Post-Retraction1
Pre-Retraction0
Same DayHeavy Metals Removal Using Carbon Based Nanocomposites
Unknown Authors
Unknown Journal
Published: Unknown
Analysis of Thermomechanical Stresses in Silicon During Heating of Aluminum Interconnects on its Surface by a Pulse Current
А. А. Скворцов, Vladimir K. Nikolaev, M. V. Koryachko et al. (5 authors)
Silicon
Published: Feb 2023
1 citation
1 citation
245 days before retraction
Quick Stats
Total Citations:
2
Years Since Retraction:
2.1 years
Open Access:
Yes
Last Checked:
Jul 24, 2025