Retraction
Low Thermal Expansion Coefficient Electrodeposited Copper and Its Contraction Mechanism by Annealing
Paper Information
Record ID:
7448
Author(s):
Publication Date:
January 27, 2017
Retraction Date:
May 27, 2017
(8.5 years years ago)
Subjects:
Institution:
Fine Feature Electrodeposition Research Center, Osaka Prefecture University, Naka-ku, Sakai, Osaka 599-8531, JapanCountry:
🇯🇵 JapanArticle Type:
Publisher:
ECS - The Electrochemical Society
Open Access:
Yes
DOI:
PubMed ID:
Not indexed in PubMed
Retraction PubMed ID:
Not indexed in PubMed
Retraction Details
Citations (1)
1
Total Citations1
Post-Retraction(100.0%)
0
Pre-Retraction0
Same DayPost-Retraction Citation Analysis
0
Within 30 days
0
Within 1 year
1
After 2+ years
945
Days since retraction (latest)
Paper citing Low Thermal Expansion Coefficient Electrodeposited...
Unknown Authors
Unknown Journal
Published: Dec 2019
945 days after retraction
Quick Stats
Total Citations:
1
Years Since Retraction:
8.5 years
Open Access:
Yes
Last Checked:
Never